Conference: 2010 2nd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

Conference Dates: 19 Jan - 20 Jan 2010

Location: The University of Tokyo ,Tokyo, Japan

Conference Web Site: http://www.3dwb.org/

Conference Scope: This workshop aims at reviewing the recent development of 3D/MEMS-integration based on rapidly emerging low-temperature wafer bonding as well as other low-temperature and high-density interconnect technologies. Invited and contribution papers are solicited to cover the full range of basic science, process development, and applications in volume production.

Focus: Science

Attendance: 200

Tutorials: N

Exhibits: N

IEEE Sponsor(s): Japan Council CPMT Chapter

Other Sponsor(s): Advanced Industrial Science and Technology - AIST
Institute for Advanced Micro-system Integration
Publications:

Information Contact: Ms. Natsuko kawamata
7-3-1 Hongo, Bunkyo-ku
The University of Tokyo, School of Engineering
JAPAN Tokyo 113-8656
+81 3 5841 6491
+81 3 5841 6485 (fax)
secretary.natsuko@su.t.u-tokyo.ac.jp

IEEE Conferences
3D Integration, confarence on 3D Integration